序
号
NO |
特征
Technical
ltem |
印制版标准PCB Standard |
要求
Requirement |
GB/T4588
2-1996 |
GB/T4588
4-1996 |
IEC
62326-3 |
IEC
62326-4 |
IEC
6012A |
1 |
表面和孔镀层厚度 Surface and hole plating thickness |
√ |
√ |
√ |
√ |
√ |
平均25um最小18um Avgerage25um
Min.18um |
2 |
电路绝缘性 Insulation resistance |
√ |
√ |
√ |
√ |
√ |
电阻>1.0×1010Ω Resist>1.0×1010Ω |
3 |
阻焊膜硬度 Solder resist hardness |
√ |
√ |
√ |
√ |
√ |
>3H |
4 |
阻焊剂固化和附着力 Solder resist cure and adhesion |
√ |
√ |
√ |
√ |
√ |
不呈现粘性,无拉脱落
No stick, no peel
off |
5 |
镀镍金厚度 Nickel and gold thickness |
√ |
√ |
√ |
√ |
√ |
视合同约定
By
contract |
6 |
弓曲和扭曲 Bow&twist |
√ |
√ |
√ |
√ |
√ |
表面安装印制板最大为0.75%,其余1.5%
SMT PCB less than
0.75%,other1.5% |
7 |
可焊性 Solderability |
√ |
√ |
√ |
√ |
√ |
3S可焊
3S
solderability |
8 |
插头部位厚度 Contact thickness |
√ |
√ |
√ |
√ |
√ |
+/-0.15mm |
9 |
镀层附着力 Plating adhesion |
√ |
√ |
√ |
√ |
√ |
符合拉脱式测试
Withstand pull
test |
10 |
外形尺寸 Dimension |
√ |
√ |
√ |
√ |
√ |
最大-0.3mm
Max.-0.3mm |
11 |
导线宽度减小 Line reduction |
√ |
√ |
√ |
√ |
√ |
不超过最小导线宽度的20%
Less than
20% |